Test stand:

  • Processor: Core i5-6400, Core i3-6300T
  • CPU cooler: Corsair H110i GT
  • Motherboard: ASUS Z170 PRO Gaming
  • Video card:AMD Radeon R9 Nano , 4 GB HBM
  • RAM: DDR4-2133 (15-15-15-36), 2x 8 GB
  • Storage: OCZ Vertex 3, 360 GB
  • Power supply: Corsair HX850i, 850 W
  • Periphery:Samsung U28D590D , ROCCAT ARVO, ROCCAT SAVU
  • Operating system: Windows 10 x64

A few suggestions about competition. Disputes continue over the choice of the Intel platform for assembling a gaming system unit from scratch. Our “Computer of the Month” section will serve as proof. With a budget of 50-60 thousand rubles, it is possible to collect gaming computer with Core i5. But which platform should you choose? On the one hand, there is a Core i5-6400 under LGA1151. On the other hand, there are plenty of Core i5-4460 for LGA1150 on sale. There are several arguments: the processors cost the same, the Haswell chip operates at a higher clock speed, and switching to Skylake will cost more. Therefore, one of the main motives for this testing was to compare the Core i5-6400 with the Core i5-4460 in all planes.

We will contrast the Core i3-6300T chip with the Core i3-4130. This is a rather old Haswell processor, released back in the third quarter of 2013, but comparable to the energy-efficient T-model in frequency.

Let's start with the test RAM. The test bench for Haswell processors used a dual-channel DDR3-1600 set with timings of 9-9-9-28. It is this RAM controller that is integrated into all fourth-generation Core processors. It's not surprising that Skylake chips were noticeably faster than Haswell in the AIDA64 test, because their built-in DDR4 controller supports RAM with an effective frequency of 2133 MHz. However, in real applications As our experiment showed, there is practically no difference between DDR3-1600 and DDR4-2133. The current generation of RAM is ruined by very high latency.

Description of test systems and testing methods

The main purpose of testing is to identify the performance gains that can be obtained by overclocking non-overclocking processors. Therefore, the junior representatives in the Core i5 and i3 lines, the Core i5-6400 and i3-6100 processors, that we took for testing were tested twice: in nominal operating mode and at a frequency of 4.7 GHz, which, based on the experience gained, can be considered sufficient a typical overclocking mode for Skylake generation CPUs. In addition, a full-fledged K-series overclocker processor, Core i5-6600K, also took part in the tests. Its presence in the tests is necessary in order to assess whether the overclocking performance differs between processors intended and not intended for operation in emergency modes, and if so, by how much. We tested the Core i5-6600K twice: both in nominal mode and when overclocked to 4.6 GHz (this is the maximum achievable frequency for our sample with the supply voltage increased to 1.425 V).

The complete list of components involved in the test systems is as follows:

  • Processors:
    • Intel Core i5-6600K (Skylake, 4 cores, 3.5-3.9 GHz, 6 MB L3);
    • Intel Core i5-6400 (Skylake, 4 cores, 2.7-3.3 GHz, 6 MB L3);
    • Intel Core i3-6100 (Skylake, 2 cores + HT, 3.7 GHz, 3 MB L3).
    • CPU cooler: Noctua NH-U14S.
    • Motherboard: ASUS Maximus VIII Ranger (LGA1151, Intel Z170).
    • Memory: 2 × 8 GB DDR4-3200 SDRAM, 16-18-18-36 (Corsair Vengeance LPX CMK16GX4M2B3200C16R).
    • Video card: NVIDIA GeForce GTX 980 Ti (6 GB/384-bit GDDR5, 1000-1076/7010 MHz).
    • Disk subsystem: Kingston HyperX Savage 480 GB (SHSS37A/480G).
    • Power supply: Corsair RM850i ​​(80 Plus Gold, 850 W).

Testing was performed in the operating room Microsoft system Windows 10 Enterprise Build 10586 using the following driver set:

  • Intel Chipset Driver 10.1.1.8;
  • Intel Management Engine Interface Driver 11.0.0.1157;
  • NVIDIA GeForce 361.43 Driver.

Description of the tools used to measure computing performance:

Benchmarks:

  • BAPCo SYSmark 2014 ver 1.5 - testing in Office Productivity scenarios ( office work: text preparation, spreadsheet processing, working with email and visiting Internet sites), Media Creation (working on multimedia content - creating a commercial using pre-shot digital images and videos) and Data/Financial Analysis (statistical analysis and investment forecasting based on some financial model).
  • Futuremark 3DMark Professional Edition 1.5.915 - testing in the Sky Diver, Cloud Gate and Fire Strike scenes.

Applications:

  • Adobe After Effects CC 2015 - testing rendering speed using ray tracing. The time spent by the system on rendering a pre-prepared video at 1920 × 1080@30fps is measured.
  • Adobe Photoshop CC 2015 - processing performance testing graphic images. Measures the average execution time of a test script that is a creative reworking of the Retouch Artists Photoshop Speed ​​Test, which involves typical processing of four 24-megapixel images taken digital camera.
  • Adobe Photoshop Lightroom 6.1 - testing performance when batch processing a series of images in RAW format. The test scenario involves post-processing and exporting to JPEG at 1920 × 1080 resolution and maximum quality of two hundred 12-megapixel RAW images taken with a Nikon D300 digital camera.
  • Adobe Premiere Pro CC 2015 - performance testing for non-linear video editing. The time for rendering a Blu-Ray project containing HDV 1080p25 video with various effects applied is measured.
  • Autodesk 3ds max 2016 - final rendering speed testing. Measures the time it takes to render at 1920 x 1080 resolution using the mental ray renderer of a standard Hummer scene.
  • Blender 2.76 - testing the speed of final rendering in one of the popular free packages for creating three-dimensional graphics. The duration of building the final model from Blender Cycles Benchmark rev4 is measured.
  • Microsoft Edge 20.10240.16384.0 - testing performance of Internet applications built using modern technologies. A specialized test, WebXPRT 2015, is used, which implements algorithms actually used in Internet applications in HTML5 and JavaScript.
  • TrueCrypt 7.2 - cryptographic performance testing. A benchmark built into the program is used that uses AES-Twofish-Serpent triple encryption.
  • WinRAR 5.30 - archiving speed testing. The time spent by the archiver to compress a directory with various files with a total volume of 1.7 GB is measured. The maximum degree of compression is used.
  • x264 r2638 - testing the speed of video transcoding into H.264/AVC format. To evaluate performance, we use an original 1080p@50FPS AVC video file with a bitrate of about 30 Mbps.
  • x265 1.8+188 8bpp - testing the speed of video transcoding into the promising H.265/HEVC format. To evaluate performance, the same video file is used as in the x264 encoder transcoding speed test.

Games:

  • Company of Heroes 2. Settings for 1280 × 800 resolution: Maximum Image Quality, Anti-Aliasing = Off, Higher Texture Detail, High Snow Detail, Physics = Off. Settings for 1920×1080 resolution: Maximum Image Quality, High Anti-Aliasing, Higher Texture Detail, High Snow Detail, Physics = High.
  • Grand Theft Auto V. Settings for 1280 × 800 resolution: DirectX Version = DirectX 11, FXAA = Off, MSAA = Off, NVIDIA TXAA = Off, Population Density = Maximum, Population Variety = Maximum, Distance Scaling = Maximum, Texture Quality = Very High, Shader Quality = Very High, Shadow Quality = Very High, Reflection Quality = Ultra, Reflection MSAA = Off, Water Quality = Very High, Particles Quality = Very High, Grass Quality = Ultra, Soft Shadow = Softest, Post FX = Ultra, In- Game Depth Of Field Effects = On, Anisotropic Filtering = x16, Ambient Occlusion = High, Tessellation = Very High, Long Shadows = On, High Resolution Shadows = On, High Detail Streaming While Flying = On, Extended Distance Scaling = Maximum, Extended Shadows Distance = Maximum. Settings for 1920×1080 resolution: DirectX Version = DirectX 11, FXAA = Off, MSAA = x4, NVIDIA TXAA = Off, Population Density = Maximum, Population Variety = Maximum, Distance Scaling = Maximum, Texture Quality = Very High, Shader Quality = Very High, Shadow Quality = Very High, Reflection Quality = Ultra, Reflection MSAA = x4, Water Quality = Very High, Particles Quality = Very High, Grass Quality = Ultra, Soft Shadow = Softest, Post FX = Ultra, In-Game Depth Of Field Effects = On, Anisotropic Filtering = x16, Ambient Occlusion = High, Tessellation = Very High, Long Shadows = On, High Resolution Shadows = On, High Detail Streaming While Flying = On, Extended Distance Scaling = Maximum, Extended Shadows Distance = Maximum.
  • F1 2015. Settings for 1280×800 resolution: Ultra High Quality, 0xAA, 16xAF. Settings for 1920×1080 resolution: Ultra High Quality, SMAA + TAA, 16xAF. The testing uses the Melbourne track.
  • Hitman: Absolution. Settings for 1280×800 resolution: Ultra Quality, MSAA = Off, High Texture Quality, 16x Texture Aniso, Ultra Shadows, High SSAO, Global Illumination = On, High Reflections, FXAA = On, Ultra Level of Detail, High Depth of Field, Tesselation = On, Normal Bloom. Settings for 1920×1080 resolution: Ultra Quality, 8x MSAA, High Texture Quality, 16x Texture Aniso, Ultra Shadows, High SSAO, Global Illumination = On, High Reflections, FXAA = On, Ultra Level of Detail, High Depth of Field, Tesselation = On, Normal Bloom.
  • Metro: Last Light Redux. Settings for 1280×800 resolution: DirectX 11, High Quality, Texture Filtering = AF 16X, Motion Blur = Normal, SSAA = Off, Tessellation = Normal, Advanced PhysX = Off. Settings for 1920×1080 resolution: DirectX 11, Very High Quality, Texture Filtering = AF 16X, Motion Blur = Normal, SSAA = On, Tessellation = Normal, Advanced PhysX = Off. Scene 1 is used for testing.
  • Tom Clancy's Rainbow Six Siege. Settings for 1280 × 800 resolution: Texture Quality = Ultra, Texture Filtering = Anisotropic 16x, LOD Quality = Ultra, Shading Quality = High, Shadow Quality = Very High, Reflection Quality = High, Ambient Occlusion = SSBC, Lens Effects = Bloom + Lens Flare, Zoom-In Depth of Field = On, Post-Process Anti-Aliasing = Off, Multisample Anti-Aliasing = Off. Settings for 1920×1080 resolution: Texture Quality = Ultra, Texture Filtering = Anisotropic 16x, LOD Quality = Ultra, Shading Quality = High, Shadow Quality = Very High, Reflection Quality = High, Ambient Occlusion = SSBC, Lens Effects = Bloom + Lens Flare, Zoom-In Depth of Field = On, Post-Process Anti -Aliasing = Off, Multisample Anti-Aliasing = MSAA 4x.
  • Thief. Settings for 1280×800 resolution: Texture Quality = Very High, Shadow Quality = Very High, Depth-of-field Quality = High, Texture Filtering Quality = 8x Anisotropic, SSAA = Off, Screenspace Reflections = On, Parallax Occlusion Mapping = On, FXAA = Off, Contact Hardening Shadows = On, Tessellation = On, Image-based Reflection = On. Settings for 1920×1080 resolution: Texture Quality = Very High, Shadow Quality = Very High, Depth-of-field Quality = High, Texture Filtering Quality = 8x Anisotropic, SSAA = High, Screenspace Reflections = On, Parallax Occlusion Mapping = On, FXAA = On, Contact Hardening Shadows = On, Tessellation = On, Image-based Reflection = On.
  • Total War: Attila. Settings for 1280×800 resolution: Anti-Aliasing = Off, Texture Resolution = Ultra; Texture Filtering = Anisotropic 4x, Shadows = Max. Quality, Water = Max. Quality, Sky = Max. Quality, Depth of Field = Off, Particle Effects = Max. Quality, Screen space reflections = Max. Quality, Grass = Max. Quality, Trees = Max. Quality, Terrain = Max. Quality, Unit Details = Max. Quality, Building Details = Max. Quality, Unit Size = Ultra, Porthole Quality = 3D, Unlimited video memory = Off, V-Sync = Off, SSAO = On, Distortion Effects = On, Vignette = Off, Proximity fading = On, Blood = On. Settings for 1920 × 1080 resolution: Maximum Quality.

So, overclocking, as we knew it a few years ago - before Intel began releasing specialized overclocking processors and blocking the ability to increase operating frequencies in other CPUs, is finally returning. It is difficult to say where the solution to the issue of removing the frequency lock of the base clock generator for the entire Skylake model range actually came from. Perhaps Intel's BCLK Governor protection turned out to be not so strong and fell under the pressure of developers Motherboard BIOS plat. But it is also possible that Intel itself pushed them in the right direction, because in the end everyone won: the microprocessor giant, board manufacturers, and users.

Indeed, thanks to the newly opened overclocking opportunities, buyers now have new arguments in favor of switching to the LGA1151 platform. There is no doubt that this will stimulate sales of new processors to a certain extent. Along the way, board manufacturers will also gain new customers, who will certainly be able to increase sales of models based on the Intel Z170. Enthusiast users will not be left out either. They face not only additional scope for experimentation, but also the opportunity to derive quite obvious financial benefits. After all, now overclocking systems can be assembled from cheaper components than before.

But what makes this whole situation especially piquant is how well everything turned out for Intel. After all, the discovery of the possibility of overclocking any, including non-overclocking, LGA1151 processors could easily cause a drop in demand for flagship Skylake models. However, sales of older Skylake with officially approved overclocking are safe. The fact is that when overclocking non-K processors, a whole bunch of problems unexpectedly arise, the worst of which is a decrease in the execution speed of AVX/AVX2 instructions. As a result, performance when working with a number of programs during overclocking not only does not increase, but, on the contrary, decreases. That is, the real benefit from such overclocking can only be obtained in cases where we are talking exclusively about working in applications that do not use the modern capabilities of the processor FPU.

All this means that if we are talking about professional activities for which the performance of CPUs operating in nominal mode is not enough, you can, as before, only choose from the Core i5-6600K or Core i7-6700K. Overclocking non-K processors is actually only suitable for playing around - in both senses of the word. On the one hand, experimenting with overclocking such processors is incredibly interesting, because this is really something new and partly forbidden. On the other hand, games are among those applications that AVX/AVX2 instructions (yet?) do not use.

However, even if you are only interested in games and programs where AVX/AVX2 extensions are not used and certainly will not be used, the overclocking ability that has appeared in the Skylake generation of neo-overclocking processors does not mean at all that you, figuratively speaking, will be able to rewind time and return to golden age of the Celeron 300A. In today's realities, it is impossible to increase the performance of a cheap processor to flagship level under any circumstances. After Intel divided the range of consumer processors into classes based on the number of cores and the list of supported technologies in the mid-2000s, any “inter-class struggle” was irrevocably a thing of the past. And this was clearly shown by the tests. The younger Core i3-6100 can only pretend to try to reach the performance of the initial Core i5 models when overclocked. And the younger Core i5-6400 can try to compete with the Core i5-6600K, but, naturally, it is not capable of competing with the Core i7-6700K.

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Characteristics
Warnings
WARNINGWill not work on 1151 boards designed for 8-series CPUs (Coffee Lake).
Main Features
ManufacturerINTEL
SeriesCore i5 6th generation
ModelCore i5-6400 Processor find a similar processor
Processor configurationOEM
PurposeDesktop PC
Description (continued)Desktop processor
CPU bus frequency8 GT/s (DMI3)
Equipment typeDesktop processor
DescriptionEnhanced Halt State (C1E), Enhanced Intel Speedstep Technology, EVP (Enhanced Virus Protection/Execute Disable Bit), Intel Virtualization Technology (VT-x), Intel Virtualization Technology for Directed I/O (VT-d), NX / XD / Execute disable bit, Hardware accelerated AES encryption, Instruction set: FMA3, 3-operand Fused Multiply-Add, Instruction sets: SSE, SSE2, SSE3, SSE4.2, AVX extensions, AVX 2.0 extensions
Power dissipation65 W
OS supportWindows 10 (64 bit only), Windows 8.1 (64 bit only), Windows 7
CPU
Processor frequency2.7 GHz or up to 3.3 GHz in mode Turbo Boost
CPU socketSocket LGA1151 compatible motherboards
CoreSkylake-S CPU core characteristics
Max. number of processors on motherboard1
L1 cache64 KB x4
L2 cache256 KB x4
L3 cache6 MB
64 bit supportYes
Number of cores4
Number of threads4
Multiplication27
Video
Processor video coreIntel HD Graphics 530
Video processor frequency350 MHz or up to 0.95 GHz maximum
Number of PCI-Express lanes16
Maximum screen resolution4096 x 2304 @ 24 Hz when connected HDMI monitor, 4096 x 2304 @ 60 Hz when connecting a DisplayPort monitor
Max. number of connected monitors3
Video card configuration
Number of shader processors24
Memory support
Supported memory typeDDR4, LV DDR3, dual channel controller compatible memory
Officially supported memory standardsPC4-17000 (DDR4 2133 MHz), PC4-15000 (DDR4 1866 MHz), PC3-12800 (DDR3 1600 MHz), PC3-10600 (DDR3 1333 MHz)
Max RAM capacity64 GB
ECC supportNo
Configuration
Technical process14 nm
Logistics
Package dimensions (measured in NICS)3.75 x 3.75 x 0.5 cm
Gross weight (measured in NICS)0.03 kg
Package dimensions according to rangefinder (measured in NICS)3.75 x 3.75 x 0.5 cm
Gross weight by scale (measured in NICS)0.03 kg

The characteristics, delivery package and appearance of this product may differ from those indicated or may be changed by the manufacturer without being reflected in the NICS - Computer Supermarket catalog.
Information about product prices and configurations indicated on the website does not constitute an offer in the sense defined by the provisions of Art. 435 of the Civil Code of the Russian Federation.

Processor Options, Consumables, and Accessories INTEL Core i5-6400 Processor OEM Reviews

We tried to make the description as good as possible so that your choice would be unmistakable and informed, but... We may not have used this product, but only touched it from all sides, and after you buy it, try it out, your review can make this world a better place, if your review is really useful, we will publish it and give it You have the opportunity to make your next purchase from us using the 2nd column.

— Processor for win7.

5 Gaidaichuk Alexey Sergeevich 08/16/2019

INTEL Core i5 6th generation Core i5-6500 Processor
Advantages:
Perhaps the main plus, if you forget that this is Intel, is compatibility with Win 7.
Flaws:
Well, as always, the price of Intel...

An excellent universal solution for any needs and tasks

5 Evgeniy Borisovich Kasatkin 11/30/2018

INTEL Core i5 6th Generation Core i5-6600 Processor - Great gem!

5 Sergey 09/15/2017

Device owner rating: INTEL Core i5 6th generation Core i5-6600 Processor
Advantages:
Fast, cold, excellent!
Flaws:
The standard cooler is still rather weak. Even MX-4 paste does not help; under load the temperature creeps up. So I advise you to take a separate stone and a separate cooling system.

INTEL Core i5 6th generation Core i5-6400 Processor - Happy with the processor

5 Karnyukhin A.S. 19-06-2017

Device owner rating: INTEL Core i5 6th generation Core i5-6400 Processor
Advantages:
A decent processor at a reasonable price. Plus, the price here at the time of purchase was lower than in other stores.
Flaws:
We can only attribute it to the fact that this is already the previous generation, but it is coping so far. I hope the socket doesn't change in the next iteration

INTEL Core i5 6th generation Core i5-6500 Processor - Fast delivery, great product

5 Mironov Dmitry 04/18/2017

Device owner rating: INTEL Core i5 6th generation Core i5-6500 Processor
Advantages:
Excellent performance in Adobe Premiere Pro and Adobe After Effects when paired with the mother of the ASUS-H170, the video old man GTX550TI, which is actually what I took for this. All the way, cold, fast rendering of 3D compositions, fast conversion, in one word for working with video, simply LUSY.
Flaws:
I haven’t found any shortcomings yet, but as always, there are complaints about our mail, with 100% prepayment and shipping by EMS 1st class, you have to go receive it yourself.

INTEL Core i5 6th Generation Core i5-6500 Processor - Wonderful

5 Pavel 03/07/2017

Device owner rating: INTEL Core i5 6th generation Core i5-6500 Processor
Advantages:
1) It practically does not heat up, the temperature ranges from 30 during normal use to 37 in games; 2) Very fast.
Flaws:
not identified

Performance comparison and test results

To help you make an informed choice, the processor was tested at NICS Computer Supermarket on 12/18/2017. The test results are clearly displayed in a diagram and two tables.

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

#ofCores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor"s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of ​​fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Processor Graphics‡

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel® HD Graphics, Iris™ Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the Intel® Graphics Technology page for more information.

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Max Dynamic Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Video Max Memory

The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Max Resolution (HDMI 1.4)‡

Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (DP)‡

Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (eDP - Integrated Flat Panel)‡

Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.

Max Resolution (VGA)‡

Max Resolution (VGA) is the maximum resolution supported by the processor via the VGA interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

DirectX* Support

DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.

OpenGL* Support

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.

Intel® Quick Sync Video

Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.

Intel® InTru™ 3D Technology

Intel® InTru™ 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.

Intel® Clear Video HD Technology

Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Thermal Solution Specification

Intel Reference Heat Sink specification for proper operation of this processor.

T CASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Optane™ Memory Supported‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Turbo Boost Technology‡

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility‡

The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®

Intel® Hyper-Threading Technology‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)‡

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® 64‡

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core"s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology‡

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® Stable Image Platform Program (SIPP)

The Intel® Stable Image Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Secure Key

Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

Intel® Software Guard Extensions (Intel® SGX)

Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).

Intel® Memory Protection Extensions (Intel® MPX)

Intel® Memory Protection Extensions (Intel® MPX) provides a set of hardware features that can be used by software in conjunction with compiler changes to check that memory references intended at compile time do not become unsafe at runtime due to buffer overflow or underflow.

Intel® Trusted Execution Technology‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Intel® Boot Guard

Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.